مشخصات پژوهش

صفحه نخست /Modeling and Quantification ...
عنوان Modeling and Quantification of Substrate Noise Induced by Interconnects in SOCs
نوع پژوهش مقاله ارائه شده کنفرانسی
کلیدواژه‌ها Substrate coupling noise, interconnect,finite difference method,capacitive coupling,VLSI circuits
چکیده Interconnects carrying high-frequency signals are of the most important sources of substrate noise. This paper computes the amount of the interconnect-induced substrate noise. We develop a substrate extraction tool based on the Finite Difference Method and combine the extracted output model with accurate interconnect models. Through simulation of the complete substrate-interconnect model, we investigate the impacts of frequency and several interconnect geometrical parameters on the amount of the substrate noise.
پژوهشگران ناصر معصومی (نفر اول)، ثریا رستگار (نفر دوم)